1 surmount tm pin diode rohs compliant rev. v1 MA4SPS552 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for additional data sheets and product information. ma-com technical soluti ons and its affiliates reserve th e right to make changes to the product(s) or information cont ained herein wi thout notice. advanced: data sheets contain information regarding a product ma-com technical solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaran- teed. preliminary: data sheets contain information regarding a product ma-com technical solutions has under development. performance is based on engineering tests. specifica- tions are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. a b c de f g dim. in mm min. max. min. max. a 0.0207 0.0226 0.525 0.575 b 0.0108 0.0128 0.275 0.325 c 0.0040 0.0080 0.102 0.203 d 0.0069 0.0089 0.175 0.225 e 0.0018 0.0037 0.045 0.095 f 0.0061 0.0081 0.155 0.205 g 0.0069 0.0089 0.175 0.225 features surface mount device no wirebonds required rugged silicon-glass construction silicon nitride passivation polymer scratch protection ultra-low parasitic capacitance and inductance higher power handling ( efficient heat sinking ) description this device is a silicon-glass pin diode chip fabricated with m/a-com technology solutions patented hmic process. this device features two silicon pedestals em- bedded in a low loss glass. the diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal side- walls conductive. selectiv e backside metalization is applied producing a surface mount device. the topside is fully encapsulated with silicon nitride and has an addi- tional polymer layer for scratch protection. these pro- tective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. absolute maximum ratings ta = +25c (unless otherwise specified) parameter absolute maximum forward current 100 ma reverse voltage -200 v operating temperature -65c to +150c storage temperature -65c to +150c junction temperature +175c dissipated rf & dc power 1w mounting temperature +235c for 10 seconds 1. backside metal: 0.1 micron thk. applications these packageless devices ar e suitable for usage in moderate incident power ( 5 w c.w. ) or higher incident peak power ( 200 w, 1 us, 0.001 duty ) series, shunt, or series-shunt switches. small parasitic inductance, 0.7 nh, and excellent rc constant, 0.20 ps, make the de- vices ideal for tr switch and accessory switch circuits, where higher p1db and ip3 values are required. these diodes can also be used in , t, tapered resis- tance, and switched-pad att enuator control circuits for 50 ? or 75 ? systems
2 surmount tm pin diode rohs compliant rev. v1 MA4SPS552 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for additional data sheets and product information. ma-com technical soluti ons and its affiliates reserve th e right to make changes to the product(s) or information cont ained herein wi thout notice. advanced: data sheets contain information regarding a product ma-com technical solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaran- teed. preliminary: data sheets contain information regarding a product ma-com technical solutions has under development. performance is based on engineering tests. specifica- tions are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. symbol parameter conditions units min. value typ. value max. value c t total capacitance -40v, 1mhz pf 0.08 0.14 c t total capacitance -40v, 1ghz pf 0.06 r s series resistance 100ma, 100mhz 1.7 r s series resistance 20ma, 100mhz 2.4 v f forward voltage 100ma v 1.00 1.25 v f forward voltage 10ma v 0.88 1.00 v r reverse voltage -10 a v | - 200 | | -275 | i r reverse leakage current -40 v na | - 10 | r qjl thermal resis- tance steady state c/w 30 tl minority carrier lifetime ( 50 % - 90 % v ) +10ma / -6ma s 2.5 electrical specifications at +25c capacitance vs frequency 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 frequency ( ghz ) cp ( pf ) 0v -5v -40v
3 surmount tm pin diode rohs compliant rev. v1 MA4SPS552 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for additional data sheets and product information. ma-com technical soluti ons and its affiliates reserve th e right to make changes to the product(s) or information cont ained herein wi thout notice. advanced: data sheets contain information regarding a product ma-com technical solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaran- teed. preliminary: data sheets contain information regarding a product ma-com technical solutions has under development. performance is based on engineering tests. specifica- tions are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. capacitance vs voltage 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 voltage ( v ) cp ( pf ) 100 mhz 1 ghz 100 mhz 1 ghz 1.0 10.0 100.0 0.01 0.10 1.00 10.00 100.00 i ( ma ) rs ( ohms ) 100mhz 1ghz rs vs i
4 surmount tm pin diode rohs compliant rev. v1 MA4SPS552 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for additional data sheets and product information. ma-com technical soluti ons and its affiliates reserve th e right to make changes to the product(s) or information cont ained herein wi thout notice. advanced: data sheets contain information regarding a product ma-com technical solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaran- teed. preliminary: data sheets contain information regarding a product ma-com technical solutions has under development. performance is based on engineering tests. specifica- tions are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 frequency (ghz) rs ( ohms ) 10ma 20ma 50ma 100ma rs vs frequency 1.0e+03 1.0e+04 1.0e+05 1.0e+06 -40.0 -35.0 -30.0 -25.0 -20.0 -15.0 -10.0 -5.0 0.0 reverse bias ( -v ) rp ( ohms ) 100mhz 1ghz parallel resistance vs v
5 surmount tm pin diode rohs compliant rev. v1 MA4SPS552 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for additional data sheets and product information. ma-com technical soluti ons and its affiliates reserve th e right to make changes to the product(s) or information cont ained herein wi thout notice. advanced: data sheets contain information regarding a product ma-com technical solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaran- teed. preliminary: data sheets contain information regarding a product ma-com technical solutions has under development. performance is based on engineering tests. specifica- tions are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. MA4SPS552 ins & ret loss -1 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0 0 123456 fr e q ghz loss db -35 -30 -25 -20 -15 -10 -5 0 loss db s21 s11 s22 ma4sps522 isolation -30 -25 -20 -15 -10 -5 0 0123456 freq ghz loss db s21
6 surmount tm pin diode rohs compliant rev. v1 MA4SPS552 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for additional data sheets and product information. ma-com technical soluti ons and its affiliates reserve th e right to make changes to the product(s) or information cont ained herein wi thout notice. advanced: data sheets contain information regarding a product ma-com technical solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaran- teed. preliminary: data sheets contain information regarding a product ma-com technical solutions has under development. performance is based on engineering tests. specifica- tions are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. handling all semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. the use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual compo- nents. bulk handling should insure that abrasion and mechanical shock are minimized. die attach attachment to a circuit board is made simple through the use of surface mount technology. mounting pads are conveniently located on the bottom surface of these devi ces and are removed from the active junction locations. these devices are well suited for solder attachment ont o hard and soft substrates. the use of 80au/20sn and 60sn/40pb solder is recommended. conductiv e epoxy for attachment may also be used. when soldering these devices to a har d substrate, hot gas die bonding is pr eferred. we re-commend utilizing a vacuum tip and force of 60 to 100 grams appli ed normal to the top su rface of the device. when soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. position the die so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die. equal heat must be applied to both ohmic contacts. since the hmic glass is trans- parent, the edges of the mounting pads closest to each ot her can be visually inspected through the die after at- tach is completed. recommended temperature and re-flow profiles for 60/40, sn/pb and rohs compliant solders are provided in application note m538 , ?surface mounting instructions?. MA4SPS552 surmounts may be ordered in either gel packs or tape and reeled by adding the appropriate suffix per the table below. tape and reel dimensions are provided in application note m513 located on the m/a- com website at www.macomtech.com . ordering information part number package MA4SPS552 die in carrier MA4SPS552-t tape/reel MA4SPS552-w wafer on frame
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